Thermal Effusivity/Conductivity of Sintered Alumina at Micrometer-scale

نویسندگان
چکیده

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Thermal Analysis of Sintered Silver Nanoparticles Film

Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. The defects in material...

متن کامل

Microstructure and mechanical properties of pressureless sintered alumina-silver composites

The silver toughened alumina ceramics, which were fabricated via a conventional ceramic processing route using commercially available alumina and silver oxide powders as the starting materials, exhibit a higher fracture toughness (6 to 9 MPamo.5) than the monolithic alumina ceramic ( 2.5 to 3.0 MPamo.5). The weak interfacial bonding between the silver inclusions and the alumina matrix is charac...

متن کامل

Micrometer-scale ballistic transport in encapsulated graphene at room temperature.

Devices made from graphene encapsulated in hexagonal boron-nitride exhibit pronounced negative bend resistance and an anomalous Hall effect, which are a direct consequence of room-temperature ballistic transport at a micrometer scale for a wide range of carrier concentrations. The encapsulation makes graphene practically insusceptible to the ambient atmosphere and, simultaneously, allows the us...

متن کامل

thermal analysis of sintered silver nanoparticles film

thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to the heat removal capability and thermal management of the power package. the defects in material...

متن کامل

Atomic Scale Mechanism of the Transformation of -Alumina to -Alumina

The following item is made available as a courtesy to scholars by the author(s) and Drexel University Library and may contain materials and content, including computer code and tags, artwork, text, graphics, images, and illustrations (Material) which may be protected by copyright law. Unless otherwise noted, the Material is made available for non profit and educational purposes, such as researc...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

ژورنال

عنوان ژورنال: Journal of the Japan Society of Powder and Powder Metallurgy

سال: 2009

ISSN: 0532-8799,1880-9014

DOI: 10.2497/jjspm.56.61